POLYPAS (FXA series)
This is a non-filler type hard urethane pad that can be used for various purposes, including first polishing of semiconductor wafers and polishing of crystal oscillator optical lenses. The FXA series has high flatness and stable processing properties since its hardness is less temperature dependent than conventional urethane pads and features uniform and independent foam.
(01)
Applications
- For first and final polishing of silicon and compound semiconductor wafers
- For polishing glass substrates for LCDs
- For polishing other materials, including plastic lenses, stainless and copper plates
- For cleaning panels
(02)
Characteristics
- High flatness
- Low scratch
- For the physical properties and characteristics of various products, please contact us.
(03)
Secondary processing and shipping conditions
- All POLYPAS series can be delivered with double-sided adhesive on the back of polishing pads.
- The pad can be perforated or grooved upon request.
- POLYPAS pads can be shipped in any of the specified sizes and shapes, including round, square, and donut shapes, upon request.
Contact
Fujibo Ehime Co., Ltd.,
Tokyo Office
1-18-12, Ningyocho, Nihonbashi,
Chuo-ku, Tokyo 103-0013, Japan
TEL : +81-3-3665-7751
FAX : +81-3-3667-1326
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