POLYPAS (Back Pad series)
This was developed to retain semiconductor silicon wafers and LCD glass substrates without wax. Users can select optimal mounting pads for specific polishing requirements to gain the highest level of flatness. An insert type without a frame and a template type with a frame are available, and a variety of products are available in these types.
(01)
Applications
- For holding polishing of silicon and compound semiconductor wafers
- For holding polishing of glasses for displays
- For holding polishing of other materials, including plastic lenses, stainless and copper plates
(02)
Characteristics
- For the physical properties and characteristics of various products, please contact us.
(03)
Secondary processing and shipping conditions
- All POLYPAS series can be delivered with double-sided adhesive on the back of polishing pads.
- POLYPAS pads can be shipped in any of the specified sizes and shapes, including round, square, and donut shapes, upon request.
Contact
Fujibo Ehime Co., Ltd.,
Tokyo Office
1-18-12, Ningyocho, Nihonbashi,
Chuo-ku, Tokyo 103-0013, Japan
TEL : +81-3-3665-7751
FAX : +81-3-3667-1326
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